Ravi Siddappa
1Patents
0h-index
6Co-inventors
19Inventor score
Filing activity: Mar 4, 2021 → Mar 4, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12183688B2 | Integrated circuit die package stiffeners of metal alloys having exceptionally high CTE | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.