Richard D. Copper
2Patents
2h-index
3Co-inventors
30Inventor score
Filing activity: Mar 17, 2003 → Mar 28, 2005
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6875077B2 | Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making | Performing Operations; Transporting | 12 | Expired |
| US6945846B1 | Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making | Performing Operations; Transporting | 9 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.