Rolf Schuermann
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Dec 4, 2001 → Dec 4, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6585145B2 | Die bonder and/or wire bonder with a device for holding down a substrate | Electricity | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.