Ryan Sanden
1Patents
0h-index
4Co-inventors
19Inventor score
Filing activity: Nov 20, 2024 → Nov 20, 2024
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US12424450B2 | Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the same | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.