Sai LI
4Patents
3h-index
14Co-inventors
51Inventor score
Filing activity: Sep 7, 1999 → Dec 14, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6348729B1 | Semiconductor chip package and manufacturing method thereof | Electricity | 23 | Expired |
| US8216636B2 | Method of aligning nanotubes | Electricity | 7 | Active |
| US6573123B2 | Semiconductor chip package and manufacturing method thereof | Electricity | 5 | Expired |
| US11548808B2 | Microcrystalline glass, microcrystalline glass product and manufacturing method thereof | Chemistry; Metallurgy | 1 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.