Shingo Ohsaka
8Patents
4h-index
4Co-inventors
42Inventor score
Filing activity: Jul 30, 1998 → Jul 3, 2003
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6232650A | Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting | Electricity | 59 | Expired |
| US6764878B2 | Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate | Electricity | 10 | Expired |
| US6437428B1 | Ball grid array type semiconductor package having a flexible substrate | Electricity | 4 | Expired |
| US6590275B2 | Ball grid array type semiconductor package having a flexible substrate | Electricity | 4 | Expired |
| US6448111B1 | Method of manufacturing a semiconductor device | Electricity | 2 | Expired |
| US6887739B2 | Method of manufacturing semiconductor package including forming a resin sealing member | Electricity | 2 | Expired |
| US6476466B2 | Ball grid array type semiconductor package having a flexible substrate | Electricity | 2 | Expired |
| US6759279B2 | Method of manufacturing semiconductor device having resin sealing body | Electricity | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.