Shu Wang
5Patents
2h-index
20Co-inventors
47Inventor score
Filing activity: Sep 21, 2004 → Feb 16, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7280232B2 | Method and apparatus for measuring wafer thickness | Physics | 2 | Expired |
| US7283256B2 | Method and apparatus for measuring wafer thickness | Physics | 2 | Expired |
| US12039748B2 | Bubble measurement system and method | Physics | 1 | Active |
| US12375813B2 | Inspection system and method | Electricity | 0 | Active |
| US11995860B2 | Bubble measurement system and method | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.