Takashi Kayama
3Patents
2h-index
11Co-inventors
45Inventor score
Filing activity: Sep 4, 1979 → Mar 16, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5639990A | Solid printed substrate and electronic circuit package using the same | Emerging Cross-Sectional Technologies | 238 | Expired |
| US6340518B1 | Flexible metal-clad laminates and preparation of the same | Emerging Cross-Sectional Technologies | 13 | Expired |
| US4292235A | Fiber glass reinforced resin compositions | Chemistry; Metallurgy | 1 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.