Takemi Endoh
3Patents
3h-index
10Co-inventors
40Inventor score
Filing activity: Jan 13, 1993 → Apr 3, 1995
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5430329A | Semiconductor device with bonding pad electrode | Electricity | 55 | Expired |
| US5525546A | Semiconductor device and method of manufacturing thereof | Electricity | 35 | Expired |
| US5306947A | Semiconductor device and manufacturing method thereof | Electricity | 17 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.