Thomas K. Buschor
1Patents
1h-index
8Co-inventors
25Inventor score
Filing activity: Jan 9, 1997 → Jan 9, 1997
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5894983A | High frequency, low temperature thermosonic ribbon bonding process for system-level applications | Electricity | 52 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.