Tim J. Jondrow
2Patents
2h-index
4Co-inventors
30Inventor score
Filing activity: Oct 28, 1997 → Jun 28, 1999
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5960535A | Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink | Emerging Cross-Sectional Technologies | 23 | Expired |
| US6018193A | Heat conductive substrate press-mounted in PC board hole for transferring heat from IC to heat sink | Emerging Cross-Sectional Technologies | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.