Ting Yu Fu
2Patents
2h-index
3Co-inventors
30Inventor score
Filing activity: Dec 13, 2011 → Apr 18, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9478513B2 | Semiconductor device with conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate | Electricity | 2 | Active |
| US8741764B2 | Semiconductor device and method of forming conductive pillars having recesses or protrusions to detect interconnect continuity between semiconductor die and substrate | Electricity | 2 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.