Toshimasa Kubota
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Mar 1, 2006 → Mar 1, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7740521B2 | Polishing head, polishing apparatus and polishing method for semiconductor wafer | Performing Operations; Transporting | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.