Walter Schoenleber
8Patents
6h-index
5Co-inventors
48Inventor score
Filing activity: Nov 2, 1998 → Jun 15, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6159073A | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Physics | 174 | Expired |
| US7018271B2 | Method for monitoring a substrate during chemical mechanical polishing | Physics | 84 | Expired |
| US6247998A | Method and apparatus for determining substrate layer thickness during chemical mechanical polishing | Performing Operations; Transporting | 78 | Expired |
| US6524165B1 | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Physics | 25 | Expired |
| US6221784A | Method and apparatus for sequentially etching a wafer using anisotropic and isotropic etching | Electricity | 14 | Expired |
| US7086929B2 | Endpoint detection with multiple light beams | Performing Operations; Transporting | 14 | Expired |
| US6764380B2 | Method and apparatus for measuring substrate layer thickness during chemical mechanical polishing | Physics | 6 | Expired |
| US6986699B2 | Method and apparatus for determining polishing endpoint with multiple light sources | Performing Operations; Transporting | 3 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.