Wang Tie
1Patents
1h-index
2Co-inventors
22Inventor score
Filing activity: May 18, 2001 → May 18, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6599775B2 | Method for forming a flip chip semiconductor package, a semiconductor package formed thereby, and a substrate therefor | Electricity | 23 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.