Wayne D. Kuipers
3Patents
3h-index
2Co-inventors
33Inventor score
Filing activity: Dec 3, 1990 → Oct 26, 1993
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5149671A | Method for forming multilayer indium bump contact | Emerging Cross-Sectional Technologies | 30 | Expired |
| US5393696A | Method for forming multilayer indium bump contacts | Emerging Cross-Sectional Technologies | 15 | Expired |
| USH487H | Direct cable attach method | General | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.