Wee Lim Cha
1Patents
1h-index
5Co-inventors
25Inventor score
Filing activity: Apr 2, 2004 → Apr 2, 2004
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7851899B2 | Multi-chip ball grid array package and method of manufacture | Electricity | 6 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.