Wei Chen
1Patents
1h-index
6Co-inventors
25Inventor score
Filing activity: Mar 19, 2001 → Mar 19, 2001
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6558755B2 | Plasma curing process for porous silica thin film | Electricity | 534 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.