Wei Shen
2Patents
1h-index
9Co-inventors
37Inventor score
Filing activity: Apr 22, 2011 → Jun 10, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8354739B2 | Thin semiconductor package and method for manufacturing same | Electricity | 3 | Active |
| US12142402B2 | Monolithic surface mount passive component | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.