Yangtzu Lee
3Patents
1h-index
12Co-inventors
37Inventor score
Filing activity: Mar 28, 2016 → Jan 28, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9791900B1 | Expansion card mounting assembly | Electricity | 5 | Active |
| US11778787B2 | System and method for thermal management in a computing environment | Emerging Cross-Sectional Technologies | 0 | Active |
| US11988706B2 | Trace level voltage sensor for multi-layer printed circuit boards | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.