Yeqing Su
1Patents
1h-index
6Co-inventors
25Inventor score
Filing activity: Apr 22, 2011 → Apr 22, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8354739B2 | Thin semiconductor package and method for manufacturing same | Electricity | 3 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.