Yi Wang
3Patents
1h-index
10Co-inventors
41Inventor score
Filing activity: Mar 20, 2008 → May 22, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7639501B2 | Heat sink assembly having a clip | Electricity | 3 | Active |
| US10846075B2 | Host applications of modular assembly system | Electricity | 0 | Active |
| US10456699B2 | Modular assembly system | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.