Yixin Chew
1Patents
1h-index
3Co-inventors
25Inventor score
Filing activity: Oct 30, 2002 → Oct 30, 2002
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7087458B2 | Method for fabricating a flip chip package with pillar bump and no flow underfill | Electricity | 55 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.