Yoshimi Murage
5Patents
2h-index
8Co-inventors
36Inventor score
Filing activity: Oct 12, 2007 → Mar 14, 2012
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8411415B2 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor | Emerging Cross-Sectional Technologies | 60 | Active |
| US8293860B2 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor | Emerging Cross-Sectional Technologies | 2 | Active |
| US8158095B2 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor | Emerging Cross-Sectional Technologies | 2 | Active |
| US8409756B2 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor | Emerging Cross-Sectional Technologies | 1 | Active |
| US8362187B2 | Phenol resin powder, method for producing the same, and phenol resin powder dispersion liquid | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.