Inventor · Yokohama, JP

Youichi Hosono

1Patents
1h-index
4Co-inventors
25Inventor score

Filing activity: Jan 26, 1994 → Jan 26, 1994

Most-cited inventions

PatentTitleAreaCited byStatus
US5639990A Solid printed substrate and electronic circuit package using the same Emerging Cross-Sectional Technologies 238 Expired

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.