Micromechanical sensor and method for manufacturing a micromechanical sensor

US10001374B2 · kind B2 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Jochen Reinmuth · Reutlingen, DE
• Robert Maul · Reutlingen, DE

Key dates

• Filing date: Jul 31, 2015
• Grant date: Jun 19, 2018
• Expiry date: Mar 8, 2036

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P15/125
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A micromechanical sensor is provided as including a substrate having a main extension plane and a mass element movable relative to the substrate, the movable mass element being coupled to the substrate via a spring structure, the spring structure including a first and a second spring element, the first and second spring elements extending essentially in parallel to each other in sections and being coupled to each other in sections, the spring structure including a first and a second compensation element for quadrature compensation, the first compensation element being connected to the first spring element, the second compensation element being connected to the second spring element, the first spring element having a first spring structure width extending along a transverse direction, the second spring element having a second spring structure width extending along the transverse direction, the first compensation element in a first subarea extending in parallel to the transverse direction along a first width, the first spring structure width and the first width being different, the second compensation element in a second subarea extending in parallel to the transverse direction along…