Micrometer mechanical force interface
US10001418B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2017 |
| Grant date | Jun 19, 2018 |
| Priority date | — |
| Expiry date | Feb 13, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/10253
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Embodiments generally relate to device and methods for detecting force. A force sensor may include a sense die, a substrate, one or more sense elements supported by the sense die, one or more electrical contacts located on the sense die and electrically coupled to electrical traces on the substrate, and an actuation element configured to transmit a force to the sense die. The width of the actuation element may be less than the distance between the one or more electrical contacts. In some embodiments, the actuation element may include a thin wedge/plate configured to interact with the sense die at a contact point. The thin wedge/plate may allow use of a smaller sense die and/or may allow closer placement of the one or more sense elements to the contact point and/or may prevent accidental contact with the one or more electrical contacts which may lead to a short circuit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.