System and method for perforating redundant metal in self-aligned multiple patterning
US10002222B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 14, 2016 |
| Grant date | Jun 19, 2018 |
| Priority date | — |
| Expiry date | Jul 21, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG21K5/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for modifying metal portions of a layout data file associated with a self-aligned multiple patterning (SAMP) process. The method comprises receiving the layout data file that includes one or more active metal portions and layout information associated with an integrated circuit. The method also comprises converting the layout data file to further include mask information having at least a first set of trim features associated with one or more redundant metal portions and one or more active metal portions of the layout data file. The method also comprises determining the one or more redundant metal portions to be perforated. The method further comprises modifying the mask information to further include a second set of trim features for perforating the one or more redundant metal portions. The first set of trim features and the second set of trim features are associated with a trim mask of the SAMP process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.