Fingerprint identification module
US10002281B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2017 |
| Grant date | Jun 19, 2018 |
| Priority date | — |
| Expiry date | Jul 27, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2307/42
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A fingerprint identification module including a cover plate, a fingerprint identification sensor, a first adhesive layer, and at least one light source is provided. The cover plate has an inner surface, an outer surface opposite to the inner surface, and a plurality of microstructures located at the inner surface. The fingerprint identification sensor is located under the microstructures and attached to the microstructures through the first adhesive layer, wherein the first adhesive layer is adhered between a portion of the microstructures and a portion of the fingerprint identification sensor, and an air gap is located between the other portion of the microstructures and the other portion of the fingerprint identification sensor. The at least one light source is located under the inner surface and adjacent to the fingerprint identification sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.