Methods for microelectronics fabrication and packaging using a magnetic polymer
US10002828B2 · kind B2 · utility
3Cited by
19References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 19, 2017 |
| Grant date | Jun 19, 2018 |
| Priority date | — |
| Expiry date | Jan 19, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A magnetic polymer for use in microelectronic fabrication includes a polymer matrix and a plurality of ferromagnetic particles disposed in the polymer matrix. The magnetic polymer can be part of an insulation layer in an inductor formed in one or more backend wiring layers of an integrated device. The magnetic polymer can also be in the form of a magnetic epoxy layer for mounting contacts of the integrated device to a package substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.