Curing material, wire harness, and manufacturing method thereof
US10003177B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Sep 24, 2013 |
| Grant date | Jun 19, 2018 |
| Priority date | — |
| Expiry date | Sep 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R4/22
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A curing material, having a solubility parameter of 9.4 or more, contains at least a chain transfer agent that contains a compound containing a polyether structure and two or more urethane bonds or two or more urea bonds in a molecule, and a metal-containing compound. A wire harness is manufactured by supplying the curing material to a conductor exposed portion of a wire bundle including a plurality of bundled insulated wires each having a conductor covered with a covering material made of an insulating body, the conductor exposed portion being formed by removing a part of the covering material of the wire bundle to expose the conductor inside; and curing the curing material by irradiating light in a state in which a surface of the curing material is covered with a protective member formed from a resin containing a plasticizer and having light transmissivity, thereby forming a waterproof portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.