Adaptive heat dissipation
US10004160B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 14, 2017 |
| Grant date | Jun 19, 2018 |
| Priority date | — |
| Expiry date | Apr 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0201
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An adaptive heat dissipation apparatus is provided, including two or more chamber walls forming a chamber volume having a first open side and a second open side, a heat source positioned at the first open side of the chamber volume, a heat conducting surface positioned at the second open side of the chamber volume, and a thermally-expansive material occupying a predetermined portion of the chamber volume. The thermally-expansive material expands to substantially fill the chamber volume at an ambient temperature above a predetermined temperature threshold and conducts heat from the heat source to the heat conducting surface. The thermally-expansive material contracts to leave an air gap when the ambient temperature is below the predetermined temperature threshold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.