Laser cutting device
US10005155B2 · kind B2 · utility
2Cited by
2References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 2015 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Nov 23, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K71/851
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser cutting device, including a laser beam generation unit emitting a laser beam; an optical system on a traveling path of the laser beam; a laser main body providing a passage through which the laser beam travels towards a substrate after passing through the optical system; a suction unit coupled to a header of the laser main body and sucking impurities, the suction unit including a curved surface therein; and a collection unit connected to the suction unit and collecting discharged impurities, the impurities being discharged to the collection unit along the curved surface inside the suction unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.