Integrated mounting and cooling apparatus, electronic device, and vehicle
US10005355B2 · kind B2 · utility
1Cited by
30References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2015 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Nov 6, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB60K2001/003
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated mounting and cooling apparatus includes a housing body having a first mounting surface configured to receive electronic components to be cooled and a heat dissipation channel extending through the housing body under the first mounting surface. An array of cooling fins is disposed in the heat dissipation channel. The apparatus is configured to serve as a mounting surface for the electronic components, as a housing for the electronic components, and a heat-sink to cool the electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.