Curable silicone composition, and optical semiconductor device
US10005906B2 · kind B2 · utility
1Cited by
9References
8Claims
0Family size
Assignee
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Key dates
| Filing date | May 29, 2015 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Jul 10, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73265
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable silicone composition comprising: (A) an organopolysiloxane having at least two alkenyl groups in a molecule; (B) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) an adhesion promoter represented by the average unit formula; and (D) a hydrosilylation reaction catalyst. Provided is a curable silicone composition for forming a transparent cured product having high adhesion to a substrate, and an optical semiconductor device having excellent reliability made using the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.