Component with embedded sensor
US10006304B2 · kind B2 · utility
5Cited by
6References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 14, 2014 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Feb 9, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02T50/60
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
One exemplary embodiment of this disclosure relates to an article having a multi-layer wall structure having an embedded sensor. Further, the multi-layer wall structure and the sensor are bonded together.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.