Pressure sensor including a structure for controlling an adhesive layer resistant to temperature variations
US10006825B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 24, 2014 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Feb 14, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L19/147
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The invention relates to a pressure sensor including: a sensitive element including a mounting substrate, said mounting substrate including a top surface and a bottom surface, the sensitive element also including a deformable diaphragm that is connected to the top surface of the mounting substrate; a housing, in which the sensitive element is placed, said housing including a base; an intermediate structure placed between the base of the housing and the mounting substrate, said intermediate structure including a base, the base including a top surface and a bottom surface that is connected to the base of the housing, said intermediate structure being configured such as to keep the mounting substrate at a predetermined distance from the top surface of the intermediate structure; and an adhesive layer extending onto the top surface of the intermediate structure. Said adhesive layer has a thickness controlled by the predetermined distance at which the mounting substrate is kept from the top surface of the intermediate structure. The invention also relates to a method for making such a pressure sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.