Capacitive sensors for electronic devices and methods of forming the same
US10006937B2 · kind B2 · utility
4Cited by
79References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2015 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Nov 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10151
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Capacitive sensor assemblies for electronic devices, and methods of forming capacitive sensor assemblies. The capacitive sensor assembly may include a top component having an intermediate layer formed on the top component, a bottom component positioned opposite the top component, a silicone layer positioned between the top component and the bottom component, and a first electrical trace positioned adjacent the silicone layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.