Method for manufacturing waveguide structures on wafer-level and corresponding waveguide structures
US10007052B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2016 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Feb 3, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29D11/00663
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The waveguide structure can be manufactured on wafer-scale and comprises a holding structure and a first and a second waveguides each having a core and two end faces. The holding structure comprises a separation structure being arranged between the first and the second waveguide and provides an optical separation between the first and the second waveguide in a region between the end faces of the first and second waveguides. A method for manufacturing such a waveguide structure with at least one waveguide comprises shaping replication material by means of tool structures to obtain the end faces, hardening the replication material and removing the tool structures from a waveguide structures wafer comprising a plurality of so-obtained waveguides.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.