Three-dimensional (3D) photonic chip-to-fiber interposer
US10007061B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 19, 2017 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Apr 19, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/423
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method of fabricating an optical coupling device, comprising forming a waveguide mask layer on a substrate platform, wherein the waveguide mask layer comprises an array of openings comprising a first end and a second end opposite to the first end, immersing the substrate platform into a salt melt comprising ions to form an array of waveguides in the substrate platform through an ion diffusion process, and controlling a rate of immersion such that a diffusion depth of the ions varies as a function of a distance in a direction from the first end to the second end, wherein the array of waveguides extends in the direction from the first end to the second end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.