Master wafer, method of manufacturing the same, and method of manufacturing optical device by using the same
US10007124B2 · kind B2 · utility
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16Claims
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Key dates
| Filing date | Aug 28, 2015 |
| Grant date | Jun 26, 2018 |
| Priority date | — |
| Expiry date | Sep 16, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2223/54426
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A master wafer includes: a plurality of unit wafers each including a pattern disposed thereon; a coupling surface defined on each of the unit wafers; and a coupling part which couples adjacent unit wafers among the plurality of unit wafers on which the coupling surface is defined, to each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.