Disc-shaped thyristor for a plurality of plated-through semiconductor components

US10008486B2 · kind B2 · utility

Assignees

• Infineon Technologies Bipolar GmbH & Co. KG · DE
• Siemens Aktiengesellschaft · DE

Inventors

• Mario Schenk · Bad Gams, AT
• Jens Przybilla · Warstein, DE
• Reiner Barthelmess · Soest, DE
• Joerg Dorn · Buttenheim, DE

Key dates

• Filing date: Feb 17, 2015
• Grant date: Jun 26, 2018
• Expiry date: Feb 22, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/13055
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A disk cell for pressure contacting a plurality of semiconductor components via a clamping device to generate a clamping force. The disk cell includes a housing comprising at least one metallic pressure plate, a first semiconductor component arranged in the housing, and a second semiconductor component arranged in the housing. The first and second semiconductor components are different. The at least one metallic pressure plate reaches across and clamps the first and second semiconductor components, is substantially perpendicular to the clamping force, and is arranged so that the clamping force acts on the at least one metallic pressure plate to provide a local region of influence to clamp the first and second semiconductor components. The first semiconductor component is arranged below the local region of influence of the clamping force. The second semiconductor component is at least partially arranged outside the local region of influence of the clamping force.