Method for producing optoelectronic semiconductor components and optoelectronic semiconductor component

US10008639B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Britta Göötz · Regensburg, DE
• Frank Singer · Regenstauf, DE
• Lutz Höppel · Alteglofsheim, DE
• Jürgen Moosburger · Regensburg, DE

Key dates

• Filing date: Feb 20, 2015
• Grant date: Jun 26, 2018
• Expiry date: Feb 20, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/0364

Abstract

A method for producing optoelectronic semiconductor components (100) is specified, wherein a carrier (1) having a carrier main side (11) is provided. Furthermore, a plurality of singulated optoelectronic semiconductor chips (2) are provided, wherein the semiconductor chips (2) each have a main emission side (21) and a contact side (22) opposite the main emission side (21). The singulated semiconductor chips (2) are then applied to the carrier main side (11), such that the contact side (22) in each case faces the carrier main side (11). In regions between the semiconductor chips, a mask frame (3) is applied, wherein the mask frame (3) is a grid of partitions (31). In a plan view of the carrier main side (11), each semiconductor chip (2) is surrounded all around by the partitions (31). The semiconductor chips (2) are potted with a conversion material (4) such that a conversion element (41) is respectively formed on the semiconductor chips (2). In this case, the conversion element (41) at least partly covers the main emission side (21) of the respective semiconductor chip (2). The carrier (1) is then removed. In a further step, the optoelectronic semiconductor components (100) are det…