Bonding and slitting device
US10010455B2 · kind B2 · utility
0Cited by
80References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 22, 2016 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Mar 22, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1313
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A bonding and slitting device is adapted to form fin seams in absorbent articles having a front waist region, a back waist region, and a crotch region extending between the front waist region and the back waist region. The device includes a first bonding member and a second bonding member having a contact element configured to cooperate with the first bonding member to bond the front region of the chassis to the back region to define the fin seams. A slitter is configured to simultaneously act on material outboard of the bonds from both the front and back regions of the chassis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.