Integrated microneedle array delivery system
US10010707B2 · kind B2 · utility
17Cited by
11References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2012 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Apr 2, 2035 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61M2037/0046
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present disclosure provides a low-profile system and methods for delivering a microneedle array. The delivery system includes a housing that may be secured to and temporarily worn on a patient's skin. A carrier assembly coupled to a microneedle array is received in the housing proximate an applicator device. The carrier assembly is at least releasably secured to the housing and it is typically not attached or otherwise fixed to any portion of the applicator device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.