Patent · US Active

Soldering module

US10010958B2 · kind B2 · utility

3Cited by

7References

13Claims

0Family size

Assignee

ERSA GMBH · DE

Inventors

Rainer Kurtz · Wertheim, DE
Michael Schaefer · Heidenau, DE

Key dates

Filing date	Sep 30, 2016
Grant date	Jul 3, 2018
Priority date	—
Expiry date	Sep 30, 2036

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB23K2101/42
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A soldering module for a soldering system for selective wave soldering, having at least one first and one second solder pot, wherein the solder pots are displaceable along an x-axis by means of an x-axis drive, along a y-axis by means of a y-axis drive, and along a z-axis by means of a z-axis drive, wherein the axes are all arranged orthogonally in relation to each other; wherein two y-axis drives and two moving devices are provided on which the solder pots are displaceable along the y-axis by means of the y-axis drives; wherein a first moving device is associated with the first solder pot, and wherein a second moving device which is different from the first moving device is associated with the second solder pot.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.