Lapping plate and method of making
US10010996B2 · kind B2 · utility
0Cited by
27References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2016 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Sep 14, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24D2203/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present disclosure involves a method of making a lapping plate by coating a platen with solid resin powder, abrasive particles, and an aqueous carrier followed by evaporating the aqueous carrier and curing the solid resin powder to form an abrasive coating. The present disclosure also involves related lapping plates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.