Planar pressing for manufacture of displays
US10011090B1 · kind B1 · utility
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1References
19Claims
0Family size
Assignee
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Key dates
| Filing date | Jun 27, 2014 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Oct 2, 2036 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB32B2457/20
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Systems and methods for planar pressing a module are described. A module includes a first layer and a second layer coupled together by an adhesive between the first layer and second layer. The module is disposed on a planar press and the planar press is activated to apply directional pressure and heat to the module for a specified period of time.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.