Patent · US Active

Inductively curable composition

US10011699B2 · kind B2 · utility

2Cited by
34References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 18, 2015
Grant dateJul 3, 2018
Priority date—
Expiry dateAug 18, 2035

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08K2201/011
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

An inductively curable thermoset compositions comprising a thermoset resin and, dispersed therein, susceptor particles and surface modified silica particles is described.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.