Apparatus and process of electro-chemical plating
US10011918B2 · kind B2 · utility
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17Claims
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Key dates
| Filing date | Dec 23, 2014 |
| Grant date | Jul 3, 2018 |
| Priority date | — |
| Expiry date | Jun 22, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D21/18
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
An electro-chemical plating process begins with supplying a supercritical fluid into an electroplating solution to be deposited, and a bias is applied between a substrate and an electrode, which is located in the electroplating solution. The substrate is placed into the electroplating solution to deposit a material on the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.